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Substrate Technology, Inc.

#0 Prep Tool

#0 Prep Tool

The #0 Prep Tool leaves a smooth profile that is appropriate for polishing or installation of floor material. It is an excellent tool for removal of adhesives, thin-sets, surface inequalities of +/-4mm and epoxy coatings with thickness of less than 4mm. The #0 Prep Tool is a 3-in/8mm EG-backed metal bond diamond that is available in four bonds: standard, soft, hard, and extra hard. Dry removal tool only.

Dimensions

3-in.